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PSL AND PARTICLE WAFER DEPOSITION SYSTEMS
These high performance particle deposition systems
feature the most advanced atomization,
 electrostatic
classification, and deposition technologies for creating standard
polystyrene latex (PSL) wafers for calibrating KLA-Tencor,
Applied Materials, TopCon, Hitachi, and ADE wafer inspection
systems. They can also deposit uniform-sized process particles
on wafers to create wet/dry-clean standards for improving
cleaning system performance. Efficiency and throughput improvement
of 0.5% to 10% for cleaning systems is possible with these
advanced particle deposition tools from MSP. Uniform sized
process particles of SiO2, Al2O3, TiO2, Si3N4, Si, Ti, W,
Ta, Cu, etc. can be deposited on wafers to provide realistic
particle/wafer adhesion so that wafer cleaning tools can be
realistically evaluated. Both the 2300XP1 and XP2 systems
feature recipe control and automatic multi-spot and multi-size
deposition. Wafer loading and unloading is manual with the
XP1, while the XP2 features automatic wafer transfer from
open cassettes or FOUPS, permitting truly hands-off, fully
automatic operation
FEATURES
& APPLICATIONS
- High resolution, NIST (National
Institute of Standards and Technology) traceable, DMA sizing
and classification exceed proposed SEMI Standards 3094 protocol
for PSL size accuracy and size distribution width.
- Advanced Differential Mobility Analyzer (DMA)
technology featuring automatic temperature and pressure
compensation for improved system stability and measurement
accuracy.
- Calendar PM alerts to flat-panel display
(FPD) to remind operator that maintenance is required.
- User-friendly recipe-controlled software
- Automatic deposition process provides multiple-spot
deposition on one wafer, followed by self-clean and purge.
- Automatic nozzle positioning and wafer rotation
allows a variety of deposition shapes to be created: multiple
spot, ring-shaped, full-wafer deposition, and other custom-shapes.
- Automatic wafer handling provides fast, hands-free,
computer handling for 200 mm and 300 mm wafers.
- CE Mark, Semi S2, S8, S14 compliant, SEMI
standards compliant
- 30nm to 4.0µm PSL size deposition;
30nm to 1µm process particle size deposition.
- Four sonicating atomizers keep PSL spheres
and process particles suspended in solution for effective
and rapid deposition of up to 8 different PSL sizes and
four different process particle materials in a single setup
- Dual DMA option permitting PSL sphere and
process particle deposition from 30 nm to 1 µm
- Deposit process particle on wafers to provides
realistic adhesion between particle and wafer surface for
cleaning process development and cleaning system improvement
to increase efficiency and through-put.
- Deposit PSL spheres on wafers to create calibration
standards for KLA-Tencor, Applied Materials, TopCon, Hitachi,
and ADE wafer inspection systems.
- Deposit PSL spheres and process particles
on bare, film-layered, and patterned wafer to study influence
of wafer surface, and particle refractive index on optical
response of wafer inspection systems.
SPECIFICATIONS
(subject to change without notice)
Please contact MSP for detailed product specifications.
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